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BIODEVICES is part of BIOSTEC, the 10th International Joint Conference on Biomedical Engineering Systems and Technologies.
Registration to BIODEVICES allows free access to all other BIOSTEC conferences.
 

Upcoming Deadlines

Regular Paper Camera Ready and Registration: December 9, 2016
Position Paper Authors Notification: December 20, 2016
Position Paper Camera Ready and Registration: January 5, 2017
The purpose of the International Conference on Bio-Devices is to bring together researchers and practitioners from electronics, mechanical engineering, physics and related areas who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.

Conference Co-chairs

Ana FredInstituto de Telecomunicações / IST, Portugal
Hugo GamboaLIBPHYS-UNL / FCT - New University of Lisbon, Portugal
Mário VazINEGI LOME, FEUP, Portugal

PROGRAM CHAIR

Nathalia PeixotoNeural Engineering Lab, George Mason University, United States

Keynote Speakers

Bart M. ter Haar RomenyEindhoven University of Technology (TU/e), Netherlands
Joyce WesterinkPhilips Research and Eindhoven University of Technology (TU/e), Netherlands
Kristina HöökRoyal Institute of Technology, Sweden
Bethany BrackenCharles River Analytics Inc., United States

Workshops

Special Sessions



Doctoral Consortium

Chair: Maria Claudia F. Castro
Submission: December 29, 2016
Submission: December 22, 2016
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library


It is planned to publish a short list of revised and
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

In Cooperation with:

EUROMICRO   ISfTeH   AAAI   ISCB   BMES  


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS  

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